Advances in LED packaging

Innovative advances in LED technology

An overview of the rapid progress in the developments of the inorganic light emitting diode (LED) technology is presented. Innovative structures and designs of the device have led to dramatic improvements of the performance in LED technology, groundbreaking performance records are being reported constantly. This article summaries the recent progress of the high brightness LEDs, and describes th...

Advances in Wafer Level Packaging (WLP)

Wafer level packages (WLPs) with various design configurations are rapidly gaining tremendous applications throughout semiconductor industry due to small-form factor, low-cost, and high performance. Because of the innovative production processes utilized in WLP manufacturing and the accompanying rise in the price of gold, the traditional wire bonding packages are no longer as attractive as they...

Advances in Packaging Methods, Processes and Systems

The food processing and packaging industry is becoming a multi-trillion dollar global business. The reason is that the recent increase in incomes in traditionally less economically developed countries has led to a rise in standards of living that includes a significantly higher consumption of packaged foods. As a result, food safety guidelines have been more stringent than ever. At the same tim...

Packaging Design with Thermal Analysis of LED on Silicon Substrate

In this paper, we demonstrate a package method for a package component of LED (Light Emitting Diode) using state of the art MEMS technologies and careful materials selection such as using a silicon substrate to dissipate heat and match thermal expansion coefficient (CTE). The objective is to develop an LED package that can overcome LED life, high operating voltage, package degradation and the a...

Technology Advances and Globalization in Electronic and Electro-Optical Packaging